description1
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Description

Vertical 1200℃ Thermodiffusion Furnace

Model

Vertical 1200℃ Thermodiffusion Furnace

Rating

Φ3  AC  400V  50KVA

Weight(KG)

2000KG

L*W*H(mm)

3870x1000x3200  mm

Service Life(Years)

20  Years

 

 

Purpose

The machine is designed for high-temperature thermal treatment of silicon wafers with a diameter of 200 mm in order to obtain profiles of alloying impurities and oxidation of the silicon surface.

Main Characteristic

1.High-temperature operation: Diffusion furnaces typically operate at high temperatures to facilitate the diffusion of impurities in semiconductor materials. For example, their operating temperature range is usually between 600-1200℃.

2.Precise temperature control: To ensure the accuracy and consistency of the process, diffusion furnaces require precise temperature control. The precision of the constant temperature zone can reach ±0.5℃, and they have functions for automatic ramp-up and ramp-down as well as constant temperature.

3.Atmosphere control: The atmosphere control inside the diffusion furnace is crucial to ensure the effectiveness of impurity doping and crystal quality. Operations are typically conducted in a vacuum or inert gas environment to prevent contamination from impurities.

4.Batch processing capability: Diffusion furnaces are designed to process a large number of substrates, making them suitable for mass production. For example, horizontal diffusion furnaces can accommodate multiple process tubes, thereby achieving efficient batch processing.

 

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